MECHANICAL DATA
MMSI002 – SEPTEMBER 2001
EFM (R–MSIP–G5)
METAL SINGLE-IN-LINE MODULE
Suffix C
0.017 (0,43) TYP.
1.11 (28,19)
MAX.
0.95 (24,13)
MAX.
0.90 (22,86)
MAX.
0 ° –7 °
Gage Plane
Seating Plane
0.006 (0,15)
0.080 (2,03)
0.032 (0,81)
TYP.
0.025 (0,63) TYP.
0.017 (0,43) TYP.
0.100 (2,54) TYP.
0.040 (1,01) TYP.
1
0.310 (7,87)
0.160 (4,06) TYP.
0.050 (1,27)
0.960 (24,38)
0.860 (21,84)
0.040 (1,01)
?0.065 (1,65) MIN. 4 Places
Plated through connected
to ground plane
0.100 (2,54)
0.210
Note I
0.050 (1,27)
(5,33)
0.780
(19,81)
0.200 (5,08)
Note F
1
0.950
(24,13)
0.090
(2,28)
0.140
(3,55)
0.070
(1,77)
0.050 (1,27)
0.165 (4,19)
Note E
0.100 (2,54)
4 Places
0.040 (1,01)
0.280 (7,11)
0.080 (2,03)
0.230 (5,84)
Note G
Note H
0.100
(2,54)
0.050 (1,27)
5 Places
PC LAYOUT
4203196/A 08/01
NOTES: A.
B.
C.
D.
E.
F.
All linear dimensions are in inches (mm).
This drawing is subject to change without notice.
2 place decimals are " 0.030 ( " 0, 76 mm).
3 place decimals are " 0.010 ( " 0, 25 mm).
Recommended mechanical keep-out area.
Power pin connections should utilize two or more
vias per input, ground and output pin.
G. Vias are recommended to improve copper adhesion.
H. Solder mask openings to copper island for solder
joints to mechanical pins. Electrically connect
case to ground plane.
I. Case outline reference.
POST OFFICE BOX 655303
? DALLAS, TEXAS 75265
1
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